The automatic solder paste dispensing device with paste thickness monitoring is a new type of automation equipment independently developed by Shenzhen Synergie Machinery Co., Ltd. with proprietary intellectual property rights. It inherits all advantages of Synergie’s automatic paste feeding solutions, including compatibility with standard solder paste bottles from major brands without requiring special packaging; inverted dispensing without drilling holes at the bottom of paste jars; and programmable moving dispensing. On this basis, it adds a real-time solder paste height detection function with outstanding features:

Laser thickness measurement. The device uses laser reflection sensors to monitor the rolling diameter of solder paste on the stencil in real time (Figure 1). When the detected paste height falls below the set value, dispensing is triggered automatically. Compared with traditional PCB-count-based dispensing, this function enables closed-loop control of the automatic feeder with a measurement accuracy of 1mm, avoiding insufficient paste supply caused by fixed counting intervals.

Figure 1. Laser reflection sensor monitors the rolling diameter of solder paste on the stencil

By monitoring the paste roll height in real time, the system achieves closed-loop control of solder paste volume on the stencil (Figure 2), maintaining a consistent paste volume and maximizing printing quality.

Figure 2. Real-time monitoring of paste roll height enables closed-loop control

Solder paste savings. Inverted extrusion reduces residual paste in empty jars to less than 6 grams (Figure 3), minimizing waste.

Figure 3. Residual solder paste in empty jars is less than 6 grams

Improved printing efficiency. The system detects squeegee movement via sensors, with hardware and software installed independently outside the printer. Dispensing takes place during PCB loading intervals or stencil cleaning cycles without occupying production time, boosting overall efficiency.

Safety and environmental protection. Automatic dispensing eliminates direct contact between operators and solder paste, reducing health risks from volatile solvents and heavy metals and ensuring worker safety.

With Synergie’s automatic paste feeding system, customers can replace manual dispensing and effectively manage paste parameters including type, composition, shelf life, real-time volume, dispensing frequency and dosage per cycle. In the near future, Synergie’s solution will be widely adopted across China’s SMT industry, supporting the development of domestic industrial manufacturing.

Dispensing Unit with Paste Roll Height Monitor

Abstract: By installing auto paste dispenser with Paste Roll Height (PRH) monitor, the solder paste dispensing can be controlled as a close-loop system. Once the paste roll height is below the setting value, it will trigger automatic dispense.

Author: ShenZhen Synergies Machinery Co., Ltd

Date: Mar-22-2018

The solder paste dispenser with Paste Roll Height (PRH) monitor is a close-loop dispensing system developed by Shen Zhen Synergies Machinery. Compared to conventional units, the system is highlighted by the following strengths:

Compatible with different kinds of solder paste jars. The solder paste is squeezed by a special designed piston and there’s no need to drill holes underneath of the jar.

Dispensing on the fly. The solder paste dispensing trajectory can be programmed so that the solder paste can be evenly dispensed onto the stencil, the paste rolls are fully mixed and thus ensures best printing quality.

Real-time paste roll monitor. By mounting one or several laser-beam sensors around the paste roll, the system can inspect the real-time paste roll height. Once the paste roll height is below the setting value, it will trigger automatic dispense. Manufacturing defects caused by insufficient solder paste which is mostly caused by incorrect dispensing frequency can be eliminated by this close-loop system.

By installing auto paste dispenser with PRH monitor, the SMT printing progress can be greatly improved by:

The printing quality will be improved as the solder paste on the stencil can be maintained by a certain amount through the PRH monitoring.

Less residue on the empty jar, less waste. The residue solder paste on the jar can be squeezed as less as 6g, which reduces possible waste effectively.

More ergonomic and environmental. Operator no longer needs to touch the solder paste as it is enclosed by a chamber. This eliminates the risk of exposing the volatile solvent as well as the toxic metallic substances inside of the solder paste to the operators’ skin or eye.