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Synergie Machinery Exhibits at NEPCON South China 2016 and Launches Intelligent Automatic Solder Paste Feeding System

2016-05-20

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As the industrial development space expands infinitely, competition has inevitably intensified. NEPCON, a platform committed to leading the forefront of electronic manufacturing information and helping exhibitors and buyers reduce transaction costs, has focused on the domestic electronics industry for more than 30 years. From August 30 to September 1 this year, NEPCON South China 2016 (the 22nd South China International Electronics Manufacturing Equipment and Microelectronics Exhibition) will kick off at Shenzhen Convention and Exhibition Center.


Gathering world-leading brands and leading the electronics manufacturing revolution, NEPCON South China 2016 will stand at the new starting line of the domestic electronics manufacturing industry and continue to showcase the maturity and new achievements of China's electronics manufacturing to the world. Synergie Machinery will also showcase its intelligent automatic solder paste feeding system at NEPCON South China 2016, bringing cutting-edge innovative technologies and processing solutions in the industry. Visitors are welcome to visit us at Booth No. 1K09.


Currently, most customers in the mobile phone industry use manual solder paste feeding during printing. Manual operation causes residue waste, low efficiency, and easy omission of feeding. In addition, solder paste contains harmful elements such as lead and tin, posing risks to workers’ health. The few automatic feeding robots on the market have strict requirements for solder paste bottle specifications: some require drilling holes at the bottom of solder paste bottles, while others require customers to replace packaging, resulting in extra costs for customers.

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