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It can be installed on most mainstream printing presses on the market, such as DEK, MPM, and GKG.
Laser sensor with an accuracy of up to 0.1 mm.
The laser detection points can be freely set, allowing for single-point or multi-point detection and real-time monitoring of solder paste volume changes.
Detection principle diagram
Automatic solder application – the top choice for high-level automation in the SMT industry!
Solder paste suitable for a wide range of packaging methods—no bottom drilling required, and no modifications to the packaging are necessary!
It is estimated that 60,000 yuan can be saved annually.
Compatible with most Speedline models,including the UP2000, Momentum, Accela,and MPM125 BTB.
Tube-packaged automaticsoldering components
Automatic solderingcomponents for canning
User-friendly interface
Solder paste used up, less than 6 grams ofsolder paste remain in the solder paste bottle.
| Item | Details |
|---|---|
| Solder paste residue | Canned solder paste <7g; Tube solder paste <10g |
| Solder paste addition frequency | Add according to PCB quantity, add at intervals, or automatically add based on the set solder paste height. (Non-standard option, sold separately) |
| Solder paste depletion alarm | Immediate shutdown, delayed shutdown, or continued production |
| Solder paste dispensing volume control | Controlled by air pressure, controlled by nozzle size |
| Solder paste replacement time | Canned solder paste <60s; Tube solder paste <45s |
| Solder paste dispensing trajectory shape | Square, rhombus, cylindrical, polygonal (optional) |
| Adding range | 0-500mm |
| Solder paste dispensing trajectory | Set and automatically controlled according to product width |
| Power supply | 120V, Air pressure: 0.7MPa, Weight: 9kg |