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Solder Paste Roll Height Monitor Unit
The Solder Paste Roll Height Monitor Unit detects solder paste height and supports automatic solder paste application control. It improves printing stability, reduces manual solder paste addition, monitors solder paste consumption in real time, and helps reduce waste and downtime.
Parameters

Solder paste height detection option

It can be installed on most mainstream printing presses on the market, such as DEK, MPM, and GKG.

Laser sensor with an accuracy of up to 0.1 mm.

The laser detection points can be freely set, allowing for single-point or multi-point detection and real-time monitoring of solder paste volume changes.

Key technical indicators

  • Display Mode: Digital display, on/off display
  • Detection Positioning: Single point or multi-point selectable
  • Solder Paste Detection Thickness Range: 1~30mm
  • Detection Target: Solder paste rolling diameter
  • Detection Accuracy: ±0.5mm
  • Applicable Models: MPM, DEK, GKG, Fuji

Detection principle diagram

Main advantages

  • Freely set solder paste height on the stencil
  • Achieve fully closed-loop automatic solder application control
  • Multiple devices can be connected online
  • Integrate with MES systems
  • Multiple devices can be managed and controlled

Automatic solder paste application robot

Automatic solder application – the top choice for high-level automation in the SMT industry!

Solder paste suitable for a wide range of packaging methods—no bottom drilling required, and no modifications to the packaging are necessary!

Advantage

  • More uniform solder paste printing, less consumption, and improved printing performance
  • No longer relies on manual addition, saving costs
  • More intuitive solder paste usage display, higher efficiency, lower residue, and real-time computer monitoring of solder paste addition frequency and consumption
  • Lower solder paste level alarm, avoiding missed or insufficient additions due to manual forgetting to add solder paste
  • Fully enclosed system operation, minimizing direct contact with toxic substances in the solder paste and operator health risks
  • Pre-extrusion molding of solder paste before dispensing can slightly improve SPI yield
  • Eliminates unnecessary downtime, saving time and reducing costs for the production line, increasing output
  • Full closed-loop control, real-time monitoring of solder paste usage on the stencil, and automatic sensing to trigger solder addition

Economic benefit analysis

  • 1. Saves Labor Time: Assuming manual addition is done once per hour, an 8-hour shift saves 12 minutes, and 24 hours saves 30 minutes, equivalent to 300 RMB. (For a single-track line, the hourly cost is 600 RMB per line). – Assuming one operator per production line and a monthly salary of 5000 RMB, this saves 15 RMB per day in labor costs.
  • 2. Saves Solder Paste and Reduces Waste: 32g of solder paste is saved every 24 hours. At 250 RMB per 500g, this saves 16 RMB per day.
  • 3. Reduces Board Cleaning and Rework Costs Due to Insufficient Solder: Improving the SPI yield by 1% avoids 1.3 defective products per hour, equivalent to 3.9 RMB per hour (based on 3 RMB per board), saving 93.6 RMB per day.

It is estimated that 60,000 yuan can be saved annually.

Automatic solder application - the top choice for high-level automation in the SMT industry!

Compatible with most Speedline models,including the UP2000, Momentum, Accela,and MPM125 BTB.

Tube-packaged automaticsoldering components

Automatic solderingcomponents for canning

User-friendly interface

Solder paste used up, less than 6 grams ofsolder paste remain in the solder paste bottle.

Key performance indicators

Item Details
Solder paste residue Canned solder paste <7g; Tube solder paste <10g
Solder paste addition frequency Add according to PCB quantity, add at intervals, or automatically add based on the set solder paste height. (Non-standard option, sold separately)
Solder paste depletion alarm Immediate shutdown, delayed shutdown, or continued production
Solder paste dispensing volume control Controlled by air pressure, controlled by nozzle size
Solder paste replacement time Canned solder paste <60s; Tube solder paste <45s
Solder paste dispensing trajectory shape Square, rhombus, cylindrical, polygonal (optional)
Adding range 0-500mm
Solder paste dispensing trajectory Set and automatically controlled according to product width
Power supply120V, Air pressure: 0.7MPa, Weight: 9kg
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