210 Semiconductor Glue Tip Cleaning Machine - Synergies Machinery（Shenzhen）Co.,Ltd.

Parameters

The main advantages of this model are as follows:

High-speed cleaning---Can perform high-speed cleaning on various nozzles on the market. The cleaning time of a single nozzle is as low as 3 seconds, which can remove all kinds of stubborn stains in the nozzle;
Quick drying--- Drying mode program control, customers can set various drying mode by themselves to remove residual water droplets in the nozzle after cleaning.;
High cost performance---The system is controlled by an industrial computer program, with reserved installation locations for smart cameras. Customers can expand their applications by themselves, equipped with digital imaging and discrimination functions.

Nozzle imaging renderings(180X digital multiple)

type: PT0.1
Aperture: 0.1 mm
(Dirt type: epoxy resin)

type: YTS-0.25A
Aperture: 0.25 mm
(Unclean, residual glue)

type: 21072
Aperture:0.3mm
(micropores Clean)

Typical cleaning case - dispensing pins

type: PT0.1
Aperture: 0.1 mm

type: YTS-0.25A
Aperture: 0.25mm

type: 21072
Aperture: 0.3mm

Comparison between Synergie cleaning & dective all in one machine and the customer's

1.Industrial distilled water for ultra-high pressure cleaning from top to bottom
2.Cleaning nozzle without any damage
3.Clean 24 nozzles at one time
4.Recycle water to clean (every two weeks replenish water)
5.Ultra-high-speed cleaning: 24 nozzles can be cleaned, inspected and air-dried in just 5 minutes. 36 nozzles take approximately 8 minutes.

Blockage type: Glue blocks, dust and other impurities formed by the curing of epoxy glue

G25 type rubber nozzle

Material: Ceramic
Inner wall hole diameter: 0.2 mm

The inner wall cleaning effect is as follows:

Stainless steel rubber nozzle

Material: Stainless steel
Inner wall hole diameter: 0.5 mm

The inner wall cleaning effect is as follows:

Y17 type rubber nozzle

Material: Stainless steel
Inner wall hole diameter: 1.1 mm

The inner wall cleaning effect is as follows:

A typical cleaning case-SOT packaged nozzle

In the semiconductor industry, the components at the back end of chip packaging, during the handling process, involve the clamping and transportation of finished products. Due to long-term contact with silicon-based devices, it is inevitable that silicon powder-like foreign substances will clog the micro-pores during long-term operation, causing defects.

Before cleaning

After cleaning

Cleaning time: 5 minutes;

Dirty medium: epoxy resin

Cleaning modes: solvent heating soaking, ultrasonic cleaning, high-pressure spray rinsing, drying