On November 21, 2024, the Innovation Forum for Advanced Packaging & System Integration was successfully held in Suzhou. The conference focused on “Integrating the System Integration Industrial Chain: From Microassembly to Advanced Packaging.”

As a long-term partner of CEIA Electronics & Intelligent Manufacturing and Conductive High-Tech Research Institute, Shenzhen Synergie was invited to participate. Colleagues from Synergie’s East China office attended the event and showcased intelligent nozzle cleaning & inspection machines and intelligent stencil cleaning & inspection machines, presenting high-end intelligent cleaning solutions.

The conference highlighted common challenges in traditional Chinese manufacturing: poor quality control, high rework rates, difficult production traceability, low equipment utilization, delayed maintenance, inefficient cross-departmental communication, rising costs, recruitment difficulties, and frequent customer complaints.

• Common Manufacturing Challenges •

To address these issues, Synergie introduced its independently developed intelligent nozzle cleaning & inspection machine and intelligent stencil cleaning & inspection machine. The nozzle machine focuses on nozzle management, significantly reducing SMT line material loss. With integrated smart storage, sorting, cleaning and inspection, it ensures precision cleaning and inspection for tiny electronic components, greatly improving productivity and quality.

The stencil machine innovatively combines cleaning and inspection in one unit, enabling fast washing, drying, intelligent judgment and MES data upload. It saves significant space and operational costs.

• Synergie Intelligent Cleaning Equipment •

As advanced packaging evolves, maintenance, cleaning and inspection of critical components become increasingly demanding. Based on deep market insight, Synergie continues to innovate and deliver efficient, intelligent solutions.

During the conference, Synergie’s intelligent nozzle and stencil cleaning machines attracted great attention. Many enterprise representatives inquired and expressed strong cooperation interest. Through on-site demonstrations and case studies, Synergie showcased real-world application benefits. A system integration expert highly praised Synergie’s technical strength and innovation, noting the solutions would drive industry growth.

Synergie also engaged in in-depth discussions with industry leaders, exploring opportunities and challenges in advanced packaging and system integration. The exchanges strengthened partnerships and laid the groundwork for future collaboration. Synergie remains committed to open cooperation, working with upstream and downstream partners to accelerate China’s intelligent manufacturing development.