With the rapid development of industrial chains supporting smartphones, new energy vehicles and drones, large-scale high-end intelligent manufacturing has driven strong demand for automated equipment to improve quality and reduce costs. In the semiconductor industry, chip packaging remains a key challenge, requiring advanced technologies to meet demands for high performance, miniaturization, low power consumption and high integration.

(Image from the Internet)

As dispensers evolve rapidly, glue is applied and cured between chips and solder joints to protect against corrosion and extend service life. Dispensing volume control is therefore critical to product quality, and relies entirely on nozzle performance. Nozzle cleanliness directly determines dispensing quality, yet cleaning micro-holes in precision dispensing nozzles has long been an industry bottleneck.

Synergie Pioneers Precision Micro-Nozzle Cleaning

Most nozzle cleaning still relies on manual labor, which is inefficient and incomplete, harming quality and productivity. Working closely with high-end manufacturers, Synergie rejected conventional ultrasonic cleaning and developed a unique high-pressure integrated cleaning-and-inspection solution for slender micro-nozzles.

Building on the successful 211 Series Nozzle Cleaner, Synergie has expanded further with the groundbreaking 210 Series High-Speed Precision Dispensing Nozzle Cleaner for semiconductors. This solution enables source-level nozzle management and fully supports intelligent manufacturing.

Synergie 210 Series Empowers High-Quality Intelligent Manufacturing

Developed and refined over years of testing, the 210 Series delivers high-speed cleaning, drying and image verification for micro and slender dispensing components. It is ideal for semiconductor dispensing, precision coating and high-end consumer electronics assembly.

Key Features

【Superior Cleaning】Effectively removes epoxy, resin and other media
【Micro-Hole Capable】Cleans holes as small as 50μm
【Eco-Friendly Low Residue】Uses standard water-based solvents only
【Multi-Mode Cleaning】Supports high-pressure, dry ice and solvent methods
【HD Imaging Verification】5–10MP camera for precise micro-hole inspection

The 210 Series offers exceptional cost-performance with integrated cleaning, inspection and drying in a wet-dry separated, fully automatic design.
- Programmable cycles with rework for defective units
- Multiple modes: quick clean, precision clean, single inspection
- Universal compatibility via simple tray changes

A true breakthrough in precision semiconductor nozzle cleaning. For more details, contact Synergie to advance China’s high-end intelligent equipment industry.