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Synergie will launch the 305D Stencil Cleaning & Inspection Machine for the first time at electronica Shanghai 2025.

2025-02-28

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With the rapid development of semiconductors, mobile communications and new energy vehicles, intelligent manufacturing has raised increasingly demanding requirements for packaging processes. However, traditional packaging methods struggle to meet the needs of high precision and efficiency, especially in stencil cleaning and inspection.

As a key component in chip packaging, the cleanliness of stencils directly affects solder paste printing quality. Traditional cleaning methods are laborious, time-consuming and cannot guarantee thorough cleaning. As a result, market demand for intelligent stencil cleaning and inspection equipment has grown rapidly. Synergie will launch the **305D Stencil Cleaning & Inspection Machine** for the first time at productronica China.

The 305D is designed to solve the industry pain point of manual re-inspection after stencil cleaning. Through precise structural design, it ingeniously integrates stencil cleaning and inspection functions. Equipped with a high-precision vision camera that scans both sides of the stencil and intelligent software recognition technology, the machine enables fast cleaning, quick drying, intelligent judgment and MES data upload. It also adopts multi-stage cleaning to ensure effectiveness and provides two inspection modes for efficient testing.

Product Features & Specifications:

1. Fast cleaning: automatic cleaning and inspection once the stencil is loaded.

2. Intelligent defect judgment: automatic identification of non-conforming products with rewash function.

3. High compatibility: supports all common stencil sizes on the market.

4. High automation: continuous automatic drying, inspection and reflow with minimal manual intervention.

5. Easy operation: controlled by industrial PC with user-friendly software, no complicated training required.

6. High scalability: supports full-process management of cleaning and maintenance.

The launch of the 305D not only fills the market gap for intelligent stencil cleaning and inspection equipment, but also provides a brand-new solution for the semiconductor packaging industry, helping enterprises improve production efficiency. With years of experience in electronic manufacturing equipment, Synergie has always adhered to technology-driven development. Looking ahead, Synergie will continue to uphold the spirit of innovation and contribute to the advancement of the electronics manufacturing industry.

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